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Electronic Materials Letters, Volume 4, Number 3, September, 2008
High Performance Polycrystalline Thin-Film Transistors Formed by Copper Metal Induced Unidirectional Crystallization
Young-Su Kim, Min-Kyu Lee, Bong-Kwan Shin, Yong-Woo Lee, Jin-Hyun Park, and Seung-Ki Joo*
Electronic Materials Letters, vol. 4, no. 3, pp. 91-94, September, 2008
Comparative Study of Reliability Issues in La-doped Bismuth Titante Thin films According to the Bottom Electrode Materials
Jang-Sik Lee1,* and Q. X. Jia2
Electronic Materials Letters, vol. 4, no. 3, pp. 95-98, September, 2008
Comparative Study of Annealing Effects on the Structural Properties of TiN and TiAlN Coatings
Myung Ho Kong1, Hyoun Woo Kim1,*, and Hack Hui Yang2
Electronic Materials Letters, vol. 4, no. 3, pp. 99-102, September, 2008
The Enhancement of Cycle-Life Performance in LiCoO2 Thin Film by Partial Al2O3 Coating
Yuhong Oh, Donggi Ahn, Seunghoon Nam, Chunjoong Kim, Joon-Gon Lee, and Byungwoo Park*
Electronic Materials Letters, vol. 4, no. 3, pp. 103-105, September, 2008
Atomistic Computation of Local Stress and Strain Distribution around an InAs Quantum Dot between a GaAs Capping Layer and a Substrate
Eun Cheol Do and Byeong-Joo Lee*
Electronic Materials Letters, vol. 4, no. 3, pp. 107-111, September, 2008
Electron Emission Characteristics of MgO Thin Films Used for ac-PDPs: Part I. Secondary Electron Emission
Yong-Seog Kim, Sang-Hoon Yoon, Seok-Geun Ahn, Cho-Rong Hong, and Heesun Yang*
Electronic Materials Letters, vol. 4, no. 3, pp. 113-129, September, 2008
Effect of Nanoscaled SiO2 Coating on Luminescent Properties of Blue Phosphors
Hyug Jong Kim, Young Kyu Jeong, Hee Gyu Kim, and Byung Ho Choi*
Electronic Materials Letters, vol. 4, no. 3, pp. 131-133, September, 2008
Magnetic Properties of Fe-Pt Films Electrodeposited by Diffusion Control
Fei Li1, Tae Hoon Kim1, Bon Heun Koo1, Chan Gyu Lee1,*, and Toshitada Shimozaki2
Electronic Materials Letters, vol. 4, no. 3, pp. 135-139, September, 2008
Characterization of Etch Resistance Property of Imprinting Resin
Seon-Yong Hwang1, Ho-Yong Jung1, Ki-Yeon Yang1, Jun-Ho Jeong2, Kyung-Woo Choi3, and Heon Lee1,*
Electronic Materials Letters, vol. 4, no. 3, pp. 141-145, September, 2008