Electronic Materials Letters , vol. 4, no. 3, pp.141-145, September, 2008

DOI :

Characterization of Etch Resistance Property of Imprinting Resin

Seon-Yong Hwang¹, Ho-Yong Jung¹, Ki-Yeon Yang¹, Jun-Ho Jeong², Kyung-Woo Choi³, and Heon Lee^1,*
1Korea University, ²Korea Institute of Machinery and Materials, ³Korea Institute of Nuclear Safety

Abstract : Nanoimprint lithography has been intensively researched since it can fabricate nano-scale patterns on large area substrates. Thermal nanoimprinting, using a monomer-based resist has gained more interest due to its shorter process time and lower process temperature, compared to the conventional hot embossing process. A near-zero residual layer imprint process can also be done using monomer-based imprint resin, due to its low viscosity. However, the poor etch resistance of monomer-based imprint resin limits its possible applications. In this study, Methacryloxypropyl terminated Poly-Dimethylsiloxanes material was added to a monomer-based thermal imprint resin, and its effect on etch resistance and imprintability was investigated.

Keyword : nanoimprint lithography, imprint resin, etch resistance, M-PDMS (methacryloxypropyl terminated poly-dimethylsiloxanes), bi-layer imprint, benzylmethacrylate