Electronic Materials Letters

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Electronic Materials Letters, Volume 2, Number 3, December, 2006



Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections Tae-Kyu Lee^1,*, Fay Hua², and J. W. Morris, Jr.¹ Electronic Materials Letters, vol. 2, no. 3, pp. 157-160, December, 2006

Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads Young-Kun Jee, Yong-Ho Ko, Yoon-Chul Sohn, and Jin Yu Electronic Materials Letters, vol. 2, no. 3, pp. 161-166, December, 2006

Assessment of Indium Joint Strength Jongman Kim^*, Harry Schoeller, Junghyun Cho, and Seungbae Park Electronic Materials Letters, vol. 2, no. 3, pp. 167-170, December, 2006

Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages K.-W. Lee^1,*, M. A. Gaynes¹, and E. Duchesne² Electronic Materials Letters, vol. 2, no. 3, pp. 171-174, December, 2006

Material Characterization of Carbon-Nanotube-Reinforced Polymer Composite Soonwan Chung, Sandeep Makhar, Harold Ackler, and Seungbae Park^* Electronic Materials Letters, vol. 2, no. 3, pp. 175-181, December, 2006

Review of Electrically Conductive Adhesive Technologies for Electronic Packaging Myung Jin Yim^1,* and Kyung Wook Paik² Electronic Materials Letters, vol. 2, no. 3, pp. 183-194, December, 2006

Nanocarving Process: Selective and Anisotropic Gas Phase Etching of Bulk TiO2 Crystal into Oriented Arrays of Nanofibers Sehoon Yoo^* Electronic Materials Letters, vol. 2, no. 3, pp. 195-200, December, 2006

The Thermoelectric Properties of Fe-Si Alloys Chul-Hoon Pai^1,* and Hyoung-Jin Park² Electronic Materials Letters, vol. 2, no. 3, pp. 201-205, December, 2006

Relaxor Ferroelectric Polymer-ceramic Composites for High Energy Density Capacitor Applications Dae-Yong Jeong^* and Seok-Jin Yoon Electronic Materials Letters, vol. 2, no. 3, pp. 207-211, December, 2006